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MCR22-6, MCR22-8
Preferred Device
Sensitive Gate Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed and tested for repetitive peak operation required for CD ignition, fuel ignitors, flash circuits, motor controls and low-power switching applications.
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* * * * *
150 A for 2 ms Safe Area High dv/dt Very Low Forward "On" Voltage at High Current Low-Cost TO-226 (TO-92) Pb-Free Packages are Available*
SCRs 1.5 AMPERES RMS 400 thru 600 VOLTS
G A Value Unit V 400 600 K
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating Peak Repetitive Off-State Voltage (Note 1) (RGK = IK, TJ = *40 to +110C, Sine Wave, 50 to 60 Hz, Gate Open) MCR22-6 MCR22-8 On-State Current RMS (180 Conduction Angles, TC = 80C) Peak Non-repetitive Surge Current, @TA = 25C, (1/2 Cycle, Sine Wave, 60 Hz) Circuit Fusing Considerations (t = 8.3 ms) Forward Peak Gate Power (Pulse Width 1.0 msec, TA = 25C) Forward Average Gate Power (t = 8.3 msec, TA = 25C) Forward Peak Gate Current (Pulse Width 1.0 ms, TA = 25C) Reverse Peak Gate Voltage (Pulse Width 1.0 ms, TA = 25C) Operating Junction Temperature Range @ Rated VRRM and VDRM Storage Temperature Range Symbol VDRM, VRRM
IT(RMS) ITSM I2t PGM PG(AV) IFGM VRGM TJ Tstg
1.5 15 0.9 0.5 0.1 0.2 5.0 -40 to +110 -40 to +150
A A A2s W W A V C C 1
TO-92 (TO-226) CASE 029 STYLE 10
MARKING DIAGRAMS
MCR 22-x AYWW G G
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Lead Solder Temperature (Lead Length q 1/16 from case, 10 S Max) Symbol RqJC RqJA TL Max 50 160 +260 Unit C/W C/W C 1 2 3
MCR22-x = Device Code x = 6 or 8 A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
PIN ASSIGNMENT
Cathode Gate Anode
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Preferred devices are recommended choices for future use and best overall value.
1
July, 2006 - Rev. 5
Publication Order Number: MCR22-6/D
MCR22-6, MCR22-8
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted.)
Characteristic OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current (VAK = Rated VDRM or VRRM; RGK = 1000 W) ON CHARACTERISTICS Peak Forward On-State Voltage (Note 2) (ITM = 1 A Peak) Gate Trigger Current (Continuous dc) (Note 3) (VAK = 6 Vdc, RL = 100 W) Gate Trigger Voltage (Continuous dc) (Note 3) (VAK = 7 Vdc, RL = 100 W) Gate Non-Trigger Voltage (Note 2) (VAK = 12 Vdc, RL = 100 W) Holding Current (VAK = 12 Vdc, Gate Open) Initiating Current = 200 mA DYNAMIC CHARACTERISTICS Critical Rate of Rise of Off-State Voltage (TC = 110C) 2. Pulse Width = 1.0 ms, Duty Cycle v 1%. 3. RGK Current not included in measurement. dv/dt - 25 - V/ms TC = 25C TC = -40C TC = 25C TC = -40C TC = 110C IH TC = 25C TC = -40C - - 2.0 - 5.0 10 mA VTM IGT VGT VGD - - - - - 0.1 1.2 30 - - - - 1.7 200 500 0.8 1.2 - V mA V V IDRM, IRRM TC = 25C TC = 110C - - - - 10 200 mA mA Symbol Min Typ Max Unit
Voltage Current Characteristic of SCR
+ Current Anode + VTM on state IRRM at VRRM IH
Symbol
VDRM IDRM VRRM IRRM VTM IH
Parameter
Peak Repetitive Off State Forward Voltage Peak Forward Blocking Current Peak Repetitive Off State Reverse Voltage Peak Reverse Blocking Current Peak on State Voltage Holding Current Reverse Blocking Region (off state) Reverse Avalanche Region Anode -
+ Voltage IDRM at VDRM Forward Blocking Region (off state)
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MCR22-6, MCR22-8
CURRENT DERATING
TA , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE ( C) TC , MAXIMUM ALLOWABLE CASE TEMPERATURE ( C)
140
140 120 100 80 60 40 20 0 0 dc = 180 = CONDUCTION ANGLE 0.2 0.4 0.6 0.8 1.0 IT(AV), AVERAGE ON-STATE CURRENT (AMP)
100 60 20 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 = 180 = CONDUCTION ANGLE dc
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
Figure 1. Maximum Case Temperature
Figure 2. Maximum Ambient Temperature
5.0 3.0 2.0 TJ = 110C 25C 1.0 0.7 0.5 0.3 0.2
I T , INSTANTANEOUS ON-STATE CURRENT (AMP)
0.1 0.07 0.05
0.03 0.02
0.01 0 0.5 1.0 1.5 2.0 2.5 VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
Figure 3. Typical Forward Voltage
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MCR22-6, MCR22-8
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 0.7 0.5 0.3 0.2 0.1 0.07 0.05 0.03 0.02 0.01 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 t, TIME (ms) 100 200 500 1000 2000 5000 10000
Figure 4. Thermal Response
TYPICAL CHARACTERISTICS
0.8 VGT, GATE TRIGGER VOLTAGE (VOLTS) 0.7 VAK = 7.0 V RL = 100 100 I GT GATE TRIGGER CURRENT (A) 100 110 50 30 20 10 5.0 3.0 2.0 1.0 -40 -20 0 20 40 60 80 100 110
0.6 0.5 0.4 0.3 -75
-50
-25
0
25
50
75
TJ, JUNCTION TEMPERATURE (C)
TJ JUNCTION TEMPERATURE (C)
Figure 5. Typical Gate Trigger Voltage
P(AV) MAXIMUM AVERAGE POWER DISSIPATION (WATTS)
Figure 6. Typical Gate Trigger Current
10 I H , HOLDING CURRENT (mA)
2.0 1.8 30 60 90 120 180
VAK = 12 V RL = 100 W 5.0
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 0.2
dc
2.0
1.0 -40
-20
0
20
40
60
80
100 110
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TJ, JUNCTION TEMPERATURE (C)
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
Figure 7. Typical Holding Current
Figure 8. Power Dissipation
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MCR22-6, MCR22-8 TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A H2A H2B H2B
H W2 H4 H5 L1 L F1 P2 P1 P H1 W1 W T T2 F2 P2 D T1
Figure 9. Device Positioning on Tape
Specification Inches Item Tape Feedhole Diameter Component Lead Thickness Dimension Component Lead Pitch Bottom of Component to Seating Plane Feedhole Location Deflection Left or Right Deflection Front or Rear Feedhole to Bottom of Component Feedhole to Seating Plane Defective Unit Clipped Dimension Lead Wire Enclosure Feedhole Pitch Feedhole Center to Center Lead First Lead Spacing Dimension Adhesive Tape Thickness Overall Taped Package Thickness Carrier Strip Thickness Carrier Strip Width Adhesive Tape Width Adhesive Tape Position Symbol D D2 F1, F2 H H1 H2A H2B H4 H5 L L1 P P1 P2 T T1 T2 W W1 W2 Min
0.1496 0.015 0.0945 .059 0.3346 0 0 0.7086 0.610 0.3346 0.09842 0.4921 0.2342 0.1397 0.06 - 0.014 0.6889 0.2165 .0059
Millimeter Max
0.1653 0.020 0.110 .156 0.3741 0.039 0.051 0.768 0.649 0.433 - 0.5079 0.2658 0.1556 0.08 0.0567 0.027 0.7481 0.2841 0.01968
Min
3.8 0.38 2.4 1.5 8.5 0 0 18 15.5 8.5 2.5 12.5 5.95 3.55 0.15 - 0.35 17.5 5.5 .15
Max
4.2 0.51 2.8 4.0 9.5 1.0 1.0 19.5 16.5 11 - 12.9 6.75 3.95 0.20 1.44 0.65 19 6.3 0.5
NOTES: 1. Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. Component lead to tape adhesion must meet the pull test requirements. 4. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes.
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MCR22-6, MCR22-8
ORDERING & SHIPPING INFORMATION: MCR22 Series Packaging Options, Device Suffix
U.S. Europe Equivalent MCR22-8RL1 MCR22-8RL1G MCR22-6 MCR22-6G MCR22-8 MCR22-8G MCR22-6RLRA MCR22-6RLRAG MCR22-6RLRP 2000 / Tape & Ammo Pack MCR22-6RLRPG For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Flat side of TO-92 and adhesive tape visible 2000 / Tape & Reel Round side of TO-92 and adhesive tape visible 5000 Units / Box N/A, Bulk 2000 / Tape & Reel Flat side of TO-92 and adhesive tape visible Shipping Description of TO-92 Tape Orientation
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MCR22-6, MCR22-8
PACKAGE DIMENSIONS TO-92 (TO-226) CASE 29-11 ISSUE AL
A R P L
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 ---
B
K
XX G H V
1
D J C SECTION X-X N N
DIM A B C D G H J K L N P R V
STYLE 10: PIN 1. CATHODE 2. GATE 3. ANODE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MCR22-6/D

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